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Integrated circuit packaging
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31	Amkor’s Next Generation Packaging Solutions … the future is now! Paul Silvestri I Director, TSV Product Development Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:19:08 Semiconductor device fabrication Microtechnology SDRAM Field-programmable gate array Xilinx 3DS Interposer Through-silicon via Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
32	1806 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 1, NO. 11, NOVEMBER 2011 Organic Packages with Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets Add to Reading List Source URL: researcher.watson.ibm.com Language: English - Date: 2012-12-31 09:40:31 Radio electronics Radar Wireless Antenna Phased array Integrated circuit Microwave RF MEMS Fresnel zone antenna Telecommunications engineering Technology Electronic engineering
33	Market Trend with Packaging Technology Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:56 Integrated circuits Microtechnology Three-dimensional integrated circuit Ball grid array Quad-flat no-leads package Chip scale package Interposer Amkor Technology Flip chip Semiconductor device fabrication Electronics Electronic engineering
34	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
35	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
36	Microsoft Word - Implementation of On_Bonder_Curing.doc Add to Reading List Source URL: www.internationalbusinesscenter.org Language: English - Date: 2004-06-01 11:20:47 Packaging materials Organic polymers Thermosetting plastics Semiconductor device fabrication Adhesives Epoxy Ball grid array Label Integrated circuit packaging Materials science Technology Electronic engineering
37	Microsoft Word - Implementation of On_Bonder_Curing.doc Add to Reading List Source URL: www.international-business-center.com Language: English - Date: 2003-12-22 14:56:34 Packaging materials Organic polymers Thermosetting plastics Semiconductor device fabrication Adhesives Epoxy Ball grid array Label Integrated circuit packaging Materials science Technology Electronic engineering
38	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Department System Integration and Interconnection Technologies Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-07 07:58:50 Semiconductor device fabrication Integrated circuits Electrical engineering Semiconductor devices Photonics Integrated circuit packaging Three-dimensional integrated circuit Integrated circuit Printed circuit board Technology Electromagnetism Electronics
39	INTRODUCTION FROM THE 65TH ECTC PROGRAM CHAIR HENNING BRAUNISCH The 65th Electronic Components and Technology Conference (ECTC) Sheraton San Diego Hotel & Marina, San Diego, California, USA • May[removed], 2015 On beha Add to Reading List Source URL: www.ectc.net Language: English - Date: 2015-03-25 11:11:27 Electronics Electronic design Fabless semiconductor companies Reliability IMEC Intel Packaging and labeling Qualcomm Integrated circuit packaging Technology Electronic engineering Semiconductor device fabrication
40	3D-IC PACKAGING January 2015 3D-IC Leadership Team  Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-12-29 12:50:47 Fabless semiconductor companies Integrated circuits IMEC Leuven Three-dimensional integrated circuit Open-Silicon Xilinx TSMC Amkor Technology Semiconductor device fabrication Electronic engineering Electronics

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